In this paper, well-known engineering solutions that are used in practice are analyzed in terms of utilizing polyimide in space microsystem devices. Possible applications are classified according to their functional roles. Advantages and disadvantages of using polyimide in modern engineering structures are discussed. Technological methods for forming polyimide layers are considered. The main aim of this study is to analyze and summarize the data about polyimide as a promising material for using in microsystem technologies for space applications. Polyimide possesses good mechanical and dielectric properties and has high coefficient of linear thermal expansion. In microsystem engineering, polyimide layers may find numerous applications. They can be used as dielectric coatings; hardening and protective coatings; thermal deformation layers; molded flexible films; separating layers with conductive interlayer buses; flexible joints and other components in micromechanics and micro-robotics; planarization layers; membranes and films; a supporting base for microelectronic components. Polyimide has high adaptability when used as functional layers in microsystem devices. Modern technologies for forming functional polyimide layers in microsystem engineering allow high-precision manufacturing of adhesion-strong design elements. Polyimide has high mechanical strength and is resistant to various destabilizing factors of space. These properties make polyimide prospective for using in space microrobotic devices. The use of polyimide in outer space is limited by the facts that this material is subject to etching in atomic oxygen in low near-earth orbits and that it is necessary to ensure stable adhesion of polyimide to structural materials of the devices.